Netac NTBSD4P32SP-16 16GB DIMM System Memory, DDR4, 3200MHz, 1 x 16GB, 288 Pin, 1.35v, CL16-20-20-40 Bulk Packaged

Netac NTBSD4P32SP-16 16GB DIMM System Memory, DDR4, 3200MHz, 1 x 16GB, 288 Pin, 1.35v, CL16-20-20-40 Bulk PackagedNTBSD4P32SP 16 is a 2G x 64 bit (1R8) DDR4 3200 C16 SDRAM (Synchronous DRAM), memory module based on eight 2G x 8 bit FBGA components per module. The SPD is programmed to latency timing of 16 20 20 at 1. 35V. support XMP, Each 288 pin DIMM uses gold contact fingers. FEATURES Power Supply VDD=1. 35V Typical VDDQ 1. 2V Typical VPP 2. 5V Typical VDDSPD 2. 2V to 3. 6V Nominal and dynamic on die termination (ODT) for data, strobe, and mask signals Low

NTBSD4P32SP-16 is a 2G x 64-bit (1R8) DDR4-3200 C16 SDRAM (Synchronous DRAM), memory module based on eight 2G x 8-bit FBGA components per module. The SPD is programmed to latency timing of 16-20-20 at 1.35V. support XMP, Each 288-pin DIMM uses gold contact fingers.

FEATURES

Power Supply
VDD=1.35V Typical

VDDQ
1.2V Typical

VPP
2.5V Typical

VDDSPD
2.2V to 3.6V

Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals

Low-power auto self refresh (LPASR)

Data bus inversion (DBI) for data bus

On-die VREFDQ generation and calibration

Single-rank

On-board I2 serial presence-detect (SPD) EEPROM

16 internal banks; 4 groups of 4 banks each

Fixed burst chop (BC) of 4 and burst length (BL) of 8via the mode register set (MRS)

Selectable BC4 or BL8 on-the-fly (OTF)

Fly-by topology

Terminated control command and address bus

PCB
Height 1.23” (31.25mm)

RoHS Compliant and Halogen-Free

SPECIFICATIONS

CL(IDD)
16 cycles

Row Cycle Time (tRCmin)
45.75ns(min.)

Refresh to Active/Refresh Command Time (tRFCmin)
350ns(min.)

Row Active Time (tRASmin)
32ns(min.)

Maximum Operating Power
TBD W

UL Rating
94V-0

Operating Temperature
0 C to +70 C

Storage Temperature
-40 C to +85 C